Prof. Dr. rer. nat. Lothar Frey


Name:Prof. Dr. rer. nat. Lothar Frey
Postanschrift:Lehrstuhl für Elektronische Bauelemente

Cauerstr. 6
91058 Erlangen
Zimmer:1.122
Telefonnummer:09131/85-28633
Fax:09131/85-28698
E-Mail:lothar.frey@leb.eei.uni-erlangen.de
Sprechstunde:wöchentlich dienstags 9:00 - 10:00

1.122

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Lehrveranstaltungen

Betreute Arbeiten

2013

2012

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1999

1997

1996
  • Erstellung und Test eines Patterngenerators für die Mikrobearbeitung mittels FIB
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1992

Publikationen

2013
  • »Alloying of ohmic contacts to n-type 4H-SiC via laser irradiation«, Materials Science Forum 740-742, 773-776 (2013)
  • »Bimodal CAFM TDDB distributions in polycrystalline HfO2 gate stacks: The role of the interfacial layer and grain boundaries«, Microelectronic Engineering 109, 129-132 (2013)
  • »Characterization of diverse gate oxides on 4H-SiC 3D trench-MOS structures«, Materials Science Forum 740-742, 691-694 (2013)
  • »Comparative study of n-LIGBT and n-LDMOS structures on 4H-SiC«, Materials Science Forum 740-742, 887-890 (2013)
  • »Conceptional design of nano-particulate ITO inks for inkjet printing of electron devices«, Journal of Materials Science 48, 1623-1631 (2013)
  • »Electrical impact of the aluminum p-implant annealing on lateral MOSFET transistors on 4H-SiC n-epi«, Materials Science Forum 2013, 521-524 (2013)
  • »Functional epoxy polymer for direct nano-imprinting of micro-optical elements«, Microelectronic Engineering, Article in Press (2013)
  • »Influence of parasitic capacitances on conductive AFM I-V measurements and approaches for its reduction«, Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 31, art. no. 01A108 (2013)
  • »Laser alloying nickel on 4H-silicon carbide substrate to generate ohmic contacts«, Journal of Laser Micro Nanoengineering 8, 97-101 (2013)
  • »Optimization of copper top-side metallization for high performance SiC-devices«, Materials Science Forum 740-742, 801-804 (2013)
  • »Processing of silicon nanostructures by Ga+ resistless lithography and reactive ion etching«, Microelectronic Engineering, Article in Press (2013)
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